Japan partners with Rapidus and TSMC for semiconductor leap

Japan has made a significant stride in semiconductor technology, with the announcement today of a collaboration between Rapidus, the University of Tokyo, and France’s CEA-Leti to develop 1nm integrated circuits. This initiative is part of Japan’s broader strategy to enhance its manufacturing capabilities and secure its position as a leading player in the global semiconductor industry by the late 2020s.

The partnership aims to address the current gaps in Japan’s semiconductor production and is seen as a critical step towards ensuring both financial and political stability. By advancing to the forefront of semiconductor technology, Japan also seeks to strengthen its electronics supply chain security.

Simultaneously, Taiwan Semiconductor Manufacturing Company (TSMC), the world-renowned chipmaker, is exploring opportunities to produce advanced 3nm chips on Kyushu island. These chips are anticipated to be utilized in smartphones and AI technologies, marking another leap forward for Japan in the high-stakes race to dominate next-generation semiconductor production.

These joint ventures underscore Japan’s commitment to reclaiming a dominant role in semiconductor manufacturing—a sector that has become a focal point of international competition due to its importance in various cutting-edge technologies.

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